Abstract:On the basis of SnAg0.1Cu0.7 lead-free solder alloy, the effects of Ce contents on microstructure,melting characteristics,wettability and tensile properties of the solder alloy were investigated.SnAg0.1Cu0.7Cex (x = 0%, 0.01%, 0.05%, 0.1%, 0.2%) solder alloys were prepared by melting pure tin and intermediate alloys SnCu10,SnAg3, SnCe1.8 at 270 ℃, holding for 20 min, stirring evenly and cooling (repeated melting for 3 times). The microstructure of solder alloys were observed by optical microscope (OM), the melting characteristic of solder alloys were characterized by differential scanning calorimetry (DSC), the wettability of solder was measured by solderability tester, and the tensile property of solder alloy was tested by universal material tester. The results show that the microstructure can be refined by micro amount of Ce. When the content of Ce is 0.01%, the microstructure is the most refined and uniform; the liquidus temperature decreases first and then increases with the increase of Ce content, and the minimum is when the content of Ce is 0.01%; when the content of Ce increases, ta decreases first and then increases, Fmax decreases, and when the content of Ce is 0.01%, the comprehensive wettability of the alloy is the best; when the content of Ce is 0.05%, the tensile strength is the maximum.