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DOI:
有色金属工程:2021,(2):31-37
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体积分数为65%SiCp/A356复合材料的微观结构和界面反应研究
朱万波, 张正贵
(沈阳大学)
Study on the Microstructure and Interface Reaction of SiCp/A356 Composite with a Volume Fraction of 65%
zhuwanbo, zhangzhenggui
(Shenyang University)
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投稿时间:2020-07-12    修订日期:2020-08-27
中文摘要: 采用粉末冶金法制备出不同保温时间(6、12 h)的65%(体积分数,下同)SiCp/A356复合材料。利用光学金相显微镜(OM)、X射线衍射仪(XRD)、扫描电子显微镜(SEM)、透射电子显微镜(TEM)等对65%SiCp/A356复合材料的微观结构与界面反应进行研究。结果表明:在630 ℃热压温度下,保温12 h的材料致密度优于保温6 h的材料,孔洞少,有明显Si相析出;发生轻微的界面反应,反应产物以MgAl2O4为主,未发现有害相Al4C3。保温12 h材料弹性模量、热导率和热膨胀系数分别为210 GPa、216 W/(m·K)和7.3×10-6/℃(50~300 ℃)。
Abstract:65% (volume fraction, the same below) SiCp/A356 composites with different holding time (6, 12 h) were prepared by powder metallurgy. The microstructure and interfacial reaction of 65% SiCp/A356 composites were characterized by optical microscopy (OM), X-ray diffraction (XRD), scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The results show that at 630 ℃ hot pressing temperature, the density of the material after holding for 12 h is better than that of holding for 6 h, and there is obvious precipitation of Si phase; slight interfacial reaction occurs, the reaction product is mainly MgAl2O4, and no harmful phase Al4C3 is found. The elastic modulus, thermal conductivity and thermal expansion coefficient of the material were 210 GPa, 216 W/ (m·K) and 7.3×10-6 /℃ (50—300 ℃) respectively.
文章编号:     中图分类号:TG    文献标志码:
基金项目:国家重点研发计划(2017YFB0703100)
引用文本:
朱万波,张正贵.体积分数为65%SiCp/A356复合材料的微观结构和界面反应研究[J].有色金属工程,2021,(2):31-37.

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