本文已被：浏览 265次 下载 146次
投稿时间：2024-03-06 修订日期：2024-05-22
投稿时间：2024-03-06 修订日期：2024-05-22
中文摘要: 固溶时效工艺能够兼顾Cu-Fe合金的力学性能和导电性能，Fe含量是影响合金组织和性能的重要因素。采用熔铸法制备了Cu-xFe（x=1，3，5）合金，对合金进行固溶时效处理，研究了固溶时效工艺及Fe含量对合金力学性能、导电性能、微观组织的影响。结果表明，时效处理过程中Fe原子析出满足Ostwald成熟机制与Marangon迁移、聚集机制。Cu-3%Fe合金经400℃×5h时效处理，合金电导率为69.6% IACS、抗拉强度为319 MPa、维氏硬度为87.5 HV，此条件下合金力学性能和导电性能匹配最为良好。根据导电率与析出相转变体积分数间的关系，借助 Martition 定律和 Avrami 经验方程，计算得到 Cu-Fe合金在时效过程中相应的 Avrami 析出动力学方程及导电率方程，比较试验得到的导电率与导电率方程计算得到的导电率数值发现， Avrami 导电率方程可准确反应合金时效过程中导电率的变化。
Abstract:The solid solution aging process can balance the mechanical and electrical properties of Cu Fe alloy, and the Fe content is an important factor affecting the microstructure and properties of the alloy. Cu-xFe (x=1, 3, 5) alloy was prepared by melting casting method, and the alloy was subjected to solution aging treatment. The effects of solution aging process and Fe content on the mechanical properties, conductivity, and microstructure of the alloy were studied. The results indicate that the precipitation of Fe atoms during aging treatment satisfies the Ostwald maturation mechanism and Marangon migration and aggregation mechanism. After aging treatment at 400 ℃×5h, the Cu-3% Fe alloy has a conductivity of 69.6% IACS, a tensile strength of 319 MPa, and a Vickers hardness of 87.5 HV. Under these conditions, the mechanical and electrical properties of the alloy match best. Based on the relationship between conductivity and the volume fraction of precipitated phase transformation, using the Martion"s law and Avrami empirical equation, the corresponding Avrami precipitation kinetics equation and conductivity equation of Cu Fe alloy during aging process were calculated. By comparing the conductivity obtained from experiments with the conductivity values calculated from the conductivity equation, it was found that the Avrami conductivity equation can accurately reflect the changes in conductivity of the alloy during aging process.
文章编号：YSJSGC20240134 中图分类号： 文献标志码：
基金项目:国家自然科学基金项目(No. 51974129),唐山市技术创新团队培养计划项目(Grant Number 21130207D)；河北省高等学校科学技术研究项目(QN2022003)；河北省研究生创新资助项目(CXZZBS2021100).
引用文本：
韩宗恩,高绪锋,赖智博,张真豪,金雅璇,张寒雨,王旭锋,李运刚.固溶时效工艺对低Fe含量Cu-Fe合金组织性能的影响[J].有色金属工程,2025,(1):.
Han zongen,Gaoxufeng,Lai Zhibo,Zhang Zhenhao,Jin Yaxuan,Zhang Hanyu,Wang Xufeng,Li Yungang.Effect of Solid Solution Aging Process on the Microstructure and Properties of Low Fe Content Cu Fe Alloy[J].NONFERROUS METALS ENGINEERING,2025,(1):.
韩宗恩,高绪锋,赖智博,张真豪,金雅璇,张寒雨,王旭锋,李运刚.固溶时效工艺对低Fe含量Cu-Fe合金组织性能的影响[J].有色金属工程,2025,(1):.
Han zongen,Gaoxufeng,Lai Zhibo,Zhang Zhenhao,Jin Yaxuan,Zhang Hanyu,Wang Xufeng,Li Yungang.Effect of Solid Solution Aging Process on the Microstructure and Properties of Low Fe Content Cu Fe Alloy[J].NONFERROUS METALS ENGINEERING,2025,(1):.
关注微信公众号