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投稿时间:2024-06-06 修订日期:2024-06-26
投稿时间:2024-06-06 修订日期:2024-06-26
中文摘要: TZM钼合金具有比纯钼更优异的力学性能和更高的再结晶温度,适用于更广泛的应用场景,TZM箔材可以替代纯钼箔材应用于电子等领域。本文通过研究TZM箔材经过不同退火温度和高温短时退火热处理的显微组织和力学性能,发现900℃的退火可以使箔材完成去应力,并出现最大延伸率;高温短时退火提升了材料的抗拉强度,2次高温短时退火后箔材具有最大强度和较高的延伸率;杯突测试显示出于力学性能类似的规律,900℃退火使材料具有最大杯突值3mm,经过2次高温短时退火后杯突值提高23%。
Abstract:TZM molybdenum alloy has superior mechanical properties and higher recrystallization temperature than pure molybdenum, making it suitable for a wider range of application scenarios. TZM foil can replace pure molybdenum foil in electronic and other fields. This article studies the microstructure and mechanical properties of TZM foil after different annealing temperatures and high-temperature short-term annealing heat treatment. It is found that annealing at 900 ℃ can achieve stress relief and maximum elongation of the foil; High temperature short-term annealing enhances the tensile strength of the material, and after two times high-temperature short-term annealing, the foil exhibits maximum strength and higher elongation; The cupping test similar to mechanical properties, annealing at 900 ℃ resulted in a maximum cupping value of 3mm for the material. After two times high-temperature short-term annealing, the cupping value increased by 23%.
文章编号:YSJSGC20240377 中图分类号: 文献标志码:
基金项目:
作者 | 单位 | |
唐作章 | 安泰天龙钨钼科技有限公司 | tangzuozhang@attl.cn |
熊宁 | 安泰科技股份有限公司 | |
孙迪 | 安泰天龙钨钼科技有限公司 |
Author Name | Affiliation | |
TANG Zuozhang | ATTL Advanced Materials Co.,Ltd. | tangzuozhang@attl.cn |
XIONG Ning | Advanced Technology Materials Co.,Ltd. | |
SUN Di | ATTL Advanced Materials Co.,Ltd. |
引用文本:
唐作章,熊宁,孙迪.TZM钼合金箔材退火行为研究[J].有色金属工程,2024,(10):50-56.
唐作章,熊宁,孙迪.TZM钼合金箔材退火行为研究[J].有色金属工程,2024,(10):50-56.