Study on the surface treatment technology of high heat resistance electrolytic copper foil
Received:July 31, 2014  Revised:July 31, 2014
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KeyWord:high heat resistance; surface treatment technology;htg 、halogen free board
     
AuthorInstitution
JIAN Zhi-chao 江西铜业集团公司 国家铜冶炼及加工工程技术研究中心
PENG Yong-zhong 江西铜业集团公司 国家铜冶炼及加工工程技术研究中心
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Abstract:
      A new surface treatment technology of high heat resistance electrolytic copper foil was Studied, including Coarsening,curing,electroplatingZn-Ni-Co based ternary alloy, chromate passivation, dipping for organic film. The technological parameters were given and the factors influencing the parameters were analysed.The performance of copper foil obtained with above technology was tested.The results prove that the treated copper foil has a black smooth surface, without harmful elements such as cr6 and As, The copper foil has excellent anti-peel strength and resistance to oxidation, corrosion and etching, andcan be served as an alternative for the same type of importedcopper foil for application to manufacturing htg 、halogen free board and multilayer board.
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