Unsoldering Of Electronic Components from Waste Printed Circuit Boards at Low Temperature
Received:October 30, 2017  Revised:November 02, 2017
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KeyWord:waste;printed circuit;boards, electronic;components, unsoldering;at low;temperature, low-melting;alloy
           
AuthorInstitution
LiuYong 广东省资源综合利用研究所
LiuZhenzhen 广东省资源综合利用研究所
LiuMudan 广东省资源综合利用研究所
ZhouJikui 广东省资源综合利用研究所
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Abstract:
      The method of smelting solder by low-melting alloy is used to separate the electronic components from waste printed circuit boards. The materials are waste printed circuit boards of lead-tin solder and lead free solder. And the effects of temperature and duration on separation rate of the electronic components are studied. The optimized condition of lead-tin solder WPCB is determined to be 150 ℃ and 4 minutes, and that of lead free solder WPCB is 180℃ and 7 minutes. Under these conditions the separation rate of the electronic components are 97.38% and 95.25%, respectively. Alloy method can decrease the fusion temperature of the solder and environmental pollution compared with other unsoldering methods.
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