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Unsoldering Of Electronic Components from Waste Printed Circuit Boards at Low Temperature |
Received:October 30, 2017 Revised:November 02, 2017 |
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DOI: |
KeyWord:waste;printed circuit;boards, electronic;components, unsoldering;at low;temperature, low-melting;alloy |
Author | Institution |
LiuYong |
广东省资源综合利用研究所 |
LiuZhenzhen |
广东省资源综合利用研究所 |
LiuMudan |
广东省资源综合利用研究所 |
ZhouJikui |
广东省资源综合利用研究所 |
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Abstract: |
The method of smelting solder by low-melting alloy is used to separate the electronic components from waste printed circuit boards. The materials are waste printed circuit boards of lead-tin solder and lead free solder. And the effects of temperature and duration on separation rate of the electronic components are studied. The optimized condition of lead-tin solder WPCB is determined to be 150 ℃ and 4 minutes, and that of lead free solder WPCB is 180℃ and 7 minutes. Under these conditions the separation rate of the electronic components are 97.38% and 95.25%, respectively. Alloy method can decrease the fusion temperature of the solder and environmental pollution compared with other unsoldering methods. |
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